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Azdhar Dahalan
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Program Manager
Mechanical Engineering Graduate
from Tohoku University, Japan.
Proven project management and
new product development experience
Linkedin.com/in/azdhar-dahalan
EXPERTISE
Time Management
Project Management
Critical Thinking
Manufacturing
Design of Experiment
Failure Tree Analysis
Semiconductor Industry
Statistical Process Control
Control Plan
Teamwork
Verbal & Written Communication
New Product Development
Failure Mode and Effect Analysis
Advanced Product Quality Planning
Leadership
TS16949
Failure Analysis
5S
Japanese Language
EXPERIENCE
MAY 2003 – PRESENT
SENIOR PACKAGING ENGINEER/PROGRAM MANAGER, TEXAS INSTRUMENTS (M) SDN BERHAD
Lead team of engineers on projects introducing new products for assembly.
Evaluation and selection of material to be used.
Develop and setup pilot production line.
Monitoring and improving product indices before handover to sustenance group.
Coordinate work between local factory and overseas business groups before release of new products in
local factory.
Coordinate multiple new product alignment to local factory change control system.
ACHIEVEMENTS
TSSOP Shunt 2014 – Present
Team leader to qualify first shunt product in TI. Technical contribution includes new die attach material,
process and equipment introduction.
QFN Automotive Multi Chip Module 2011 – 2013
Team leader to qualify first QFN MCM for automotive application. Technical contribution includes new
die attach material & new equipment tooling introduction.
SOIC High Voltage 2010 – 2013
Team leader to introduce first MCM in SOIC product line-up. Technical contribution includes new mold
compound qualification for High Voltage application, package reliability improvement & new
equipment tooling introduction.
SSOP 2.5kV High Voltage Isolation 2010 – 2013
Team leader to qualify new SSOP package application. Technical contribution includes new leadframe
design enabling higher isolation rating from 1kV to 2.5kV.
QFN PowerClip 2009 – 2010
Team leader to find suitable die attach material replacement for solder paste. Technical contribution
includes a two level shower head design for die attach material dispensing.
QFN X2QFN 2007 – 2010
Team leader to develop the next generation of thinner QFN packages. Technical contribution includes
leadframe design, technical disclosures on wirebond heater block & die attach ejector pepperpot
design.
QFN COL 2006 – 2006
Team leader for process development, material identification and execution of QFN COL. Technical
contribution includes die attach process development and process integration.
High Performance QFN 2004 – 2005
Developed and optimized die bond process for new high performance device using DOE methodology.
Established new process specifications and conducted people training before releasing to production.
QFN Multi Chip Module 2004 – 2005
Key technical contributor for the development and qualification of MCM project. Developed die bond
process for the MCM.
QFN Product Start-up 2003 – 2005
Key member in QFN start-up team in TIM. Developed material and process for QFN die bond process.
Introduced new Esec 2008hS die bonder transport system to eliminate scratches on leadframe
backside, the first in the industry. Selecting new die attach material and redesigning the process to
increase die bonder capacity by 30% and saving equipment expenditure of RM1 million. Redefined the
assembly process and reduce the material consumption by 50% and generated RM120k savings.
Technician and operator training.
QFN SWR Coordinator 2004 – 2005
Defined new system for QFN SWR SOP to cater for the complexities in business group products.
Coordinated new device assembly requests between business groups and local factory. Supported on
time delivery of new product introduction to the customer and increase TI’s market share in analog
business. Consolidated reports and analyzing them to ensure yield and process concerns are addressed
before RTP.
OCT 2000 – MAY 2003
SENIOR ENGINEER, UNISEM (M) BERHAD
Develop die bond process for new products.
Perform equipment buyoff at supplier site to ensure purchased equipment fulfill the new product
requirements before being shipped out to Unisem.
Engineer and technician training on new equipment.
Equipment parameter optimization through DOE (Design Of Experiment) to improve product quality
and equipment efficiency.
To assist on customer claim rejection issues through executing root cause analysis and preparing
actions for countermeasures for problem recurrence prevention.
Write up work instruction/manual for new equipment.
Write up process specifications for new products.
JUNE 1998 – SEP 2000
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SENIOR ENGINEER, RIVER ELECTRONICS (M) SDN BERHAD
Production line equipment modification and upgrade.
Production line equipment parts localization.
Air compressor, air conditioning unit maintenance for total plant.
AWARDS AND HONOURS
2004 P3 Award for being pro-active in Texas Instruments.
2011 Assembly Technical Conference 3rd place
2014 Co-inventor of US patent#-. Packaged IC having printed dielectric adhesive on die pad.
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